• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A method for removing contaminants from a semiconductor wafer having a spin on coating of material. Contaminants are removed by applying a cleaning solution to the periphery, and preferably, the exposed backside of the wafer after the edge bead has been dissolved and removed. The cleaning solution is formulated to react chemically with unwanted coating material residue to form a compound that may be ejected from the periphery of the spinning wafer. Any residual solution or precipitate that is not ejected from the wafer may be rinsed away with water, preferably deoinized water. One exemplary use of this method is the removal of metallic contaminants that may be left on the periphery and backside of a wafer after the formation of ferroelectric film coatings. A cleaning solution comprising a mixture of hydrochloric acid HCl and water H2O or ammonium hydroxide NH4OH and water H2O is applied to the periphery of the spinning wafer. The cleaning solution will react with any residual metal ions to form a metal chloride or metal hydroxide that is ejected from the wafer along with the cleaning solution.
    公开号:US20010009814A1
    申请号:US09/804,604
    申请日:2001-03-12
    公开日:2001-07-26
    发明作者:J. Rolfson
    申请人:Rolfson J. Brett；
    IPC主号:H01L21-67051
    专利说明:
    [0001] 1. Technical Field [0001]
    [0002] The invention relates generally to the manufacture of semiconductor devices. More particularly, the invention relates to a method for removing contaminants from a semiconductor wafer by applying a cleaning solution to the wafer as part of the spin coat fabrication process. [0002]
    [0003] 2. Background [0003]
    [0004] Thin film fabrication techniques are commonly used in the manufacture of semiconductor devices. A variety of materials can be deposited as thin films, including photoresist, metals, and insulators. The composition and uniformity of thin films must be strictly controlled to facilitate etching submicron features into these films. Some of these materials are applied by coating the semiconductor wafer with a liquid which is dried to form a thin solid film. The liquid materials are most often coated onto the wafer using either a spin or spray coating process. In a conventional spin coating process, coating materials are applied by flowing liquid coating material onto the top surface of the semiconductor wafer while it is spinning. The wafer is held on a disk shaped, rotating spin chuck. The diameter of the chuck is typically somewhat less than the diameter of the wafer. The chuck is positioned so that the wafer lies on the chuck in a level horizontal plane. In operation, the bottom/inactive surface of the wafer is placed onto the chuck. The chuck applies a suction to the bottom of the wafer to hold the wafer in place on the chuck. The chuck is rotated by a motor driven axle that extends down from the chuck. As the wafer is rotated on the chuck, liquid coating material is applied to the center of the wafer. The coating material spreads radially outward from the center of the wafer towards the periphery to coat the top of the wafer. Ideally, all excess coating material is ejected from the periphery of the wafer. In practice, however, some excess material collects at the periphery of the wafer. The bead of coating material that forms at the periphery of the wafer is commonly referred to as an “edge bead.” In addition, coating material often splashes onto the exposed bottom surface of the wafer. [0004]
    [0005] After the material has been spin coated onto the wafer, a solvent is dispensed along the periphery of the wafer and on the exposed bottom surface or “backside” of the wafer to dissolve the edge bead and remove the coating material from the periphery and bottom of the wafer. The edge bead removal solvent may dispensed through a nozzle directed toward the bottom of the wafer, in which case it curls up around to the top of the wafer to dissolve the edge bead, or the solvent may be dispensed directly onto the periphery of the wafer, or preferably both. The edge bead removal solvent may leave trace amounts of coating material residue on the periphery and exposed bottom surface of the wafer. Unwanted residue, particularly metal residue, on the periphery and bottom of the wafers is a source of potentially harmful cross-contamination. Photoresist and other common coatings are formulated to have low metallic ion on transition metal contamination. However, sufficiently low metallic ion contamination and other film performance criteria cannot always be achieved simultaneously. For example, newer film formulations intended for use in ferroelectric random access memory (FRAM) applications contain metals. These metallic film formulations, which are necessary for FRAM device performance, are a source of contamination that may be carried to other wafers, products and processing stations. [0005] SUMMARY OF THE INVENTION
    [0006] The present invention is directed to a novel method for removing contaminants from a semiconductor wafer having a spin on coating of material. Contaminants are removed by applying a cleaning solution to the periphery, and preferably, the exposed backside of the wafer after the edge bead has been dissolved and removed. The cleaning solution is formulated to react chemically with unwanted coating material residue to form a compound that may be ejected from the periphery of the spinning wafer. Any residual solution or precipitate that is not ejected from the wafer may be rinsed away with water, preferably deoinized water. One exemplary use of this method is the removal of metallic contaminants that may be left on the periphery and backside of a wafer after the formation of ferroelectric film coatings. A cleaning solution comprising a mixture of hydrochloric acid HCL and water H[0006] 2O or ammonium hydroxide NH4OH and water H2O is applied to the periphery of the spinning wafer. The cleaning solution will react with any residual metal ions to forma metal chloride or metal hydroxide that is ejected from the wafer along with the cleaning solution. BRIEF DESCRIPTION OF THE DRAWINGS
    [0007] FIG. 1 is a partial side view of a conventional spin coating device showing a coating material being applied to the top surface of the semiconductor wafer. [0007]
    [0008] FIG. 2 is a partial side view of the spin coating device of FIG. 1 showing application of the edge bead removal solvent after formation of a thin film of coating material. [0008]
    [0009] FIG. 3 is a partial side view of the spin coating device of FIG. 1 showing application of the cleaning solution after application of the edge bead removal solvent. [0009] DETAILED DESCRIPTION OF THE INVENTION
    [0010] FIGS. [0010] 1-3 are partial side views of a conventional spin coating device showing the application of a liquid coating material at various stages in the spin coating process. Wafer 10 is positioned on spin chuck 12. Spin chuck 12 is mounted on axle 14. Axle 14 is operatively coupled to a drive mechanism, such as an electric motor (not shown). The diameter of spin chuck 12 is less than the diameter of wafer 10 so that wafer 10 extends beyond the periphery of spin chuck 12. A first nozzle 16 for dispensing a coating material onto wafer 10 is positioned above and, typically, at the center of wafer 10. Second nozzles 20 a and 20 b for dispensing an edge bead removal solvent and cleaning solution are disposed above and below the periphery 22 of wafer 10. In operation, a suction is applied to the wafer 10 to hold it in place on spin chuck 12. Spin chuck 12 is rotated to spin wafer 10 as a liquid coating material 18 is applied through first nozzle 16. Typically, the desired film material is suspended in a solvent to form the liquid coating material that is applied to the wafer. The coating material 18 is distributed across top surface 32 of wafer 10 largely due to centrifugal forces created by the spinning wafer.
    [0011] A shown in FIG. 2, excess coating material tends to collect at and form a bead [0011] 24 along the periphery 22 of wafer 10. To remove edge bead 24, a solvent 26 is sprayed through nozzle 20 a onto the periphery 22 of wafer 10 as it is spun to dissolve the coating material at the periphery of the wafer. The edge bead removal solvent 26 may also be dispensed through nozzle 20 b directed toward the exposed bottom surface 30 of wafer 10.
    [0012] Referring to FIG. 3, application of the edge bead removal solvent is followed by the application of a cleaning solution [0012] 28 to the spinning wafer to further remove residual coating materials from periphery 22 and exposed bottom surface 30 of wafer 10. Cleaning solution 28 is dispensed through nozzles 21 a and 21 b, preferably in the same pattern as the edge bead removal solvent. Although the use of separate nozzles is preferred, the same nozzles may be used to dispense solvent 26 and cleaning solution 28 if the nozzles are rinsed between applications to remove any residual solvent or solution. Conventional spin coating machines, such as a Silicon Valley Group (SVG) Coat Track or Tokyo Electron Ltd. (TEL) Mark 8, could be adapted for use in dispensing the cleaning solution. Alternatively, and particularly for those spin coating machines that do not dispense the edge bead removal solvent onto the bottom of the wafer, the cleaning solution will be applied by a separate piece of manufacturing equipment at a downstream processing station.
    [0013] Unlike the edge bead removal solvent in which the coating material is dissolved, cleaning solution is formulated to react chemically with unwanted coating material residue to form a compound that may be ejected from the periphery of the spinning wafer, as either a precipitate or solute, along with the cleaning solution. Any residual solution or precipitate that is not ejected from the spinning wafer may be rinsed away with water, preferably dionized water. Preferably the cleaning solution is formulated so that the reaction product is soluble in water to help ensure all traces of coating material residue are removed from the periphery and bottom surface of the wafer. One exemplary use of the present invention is the removal of metallic contaminants that may be left on the periphery and bottom of the water after formation of ferroelectric film coatings. Ferroelectric films used in the formation of ferrolectric random access memories (FRAMs) are typically formulated using a combination of various metallic elements including, for example, strontium Sr, bismuth Bi and tantalum ta. After the ferroelectric film has been coated on to the top surface of the wafer, the edge bead is dissolved in a solvent and the wafer is spun to remove the film from the periphery and bottom of the wafer. Many commonly used solvents, such as butyl acetate, xylene and ethyl acetate, may be used to solubilize the film. Then, a dilute mixture of hydrochloric acid HCl and water H[0013] 2O is sprayed on to the periphery of the wafer and the exposed bottom surface of the wafer as a cleaning solution to remove unwanted metallic contaminants. The cleaning solution may range from a very dilute mixture of about 1 part HCl to about 1,000 parts water to a more conventional concentration of about 1 part HCl to about 5 parts water. The hydrochloric acid will react with any residual metal ions to form a metal chloride that is ejected from the spinning wafer along with the cleaning solution. Other preferred compositions for cleaning solution 28 include a mixture of hydrochloric acid HCl, water H2O and hydrogen peroxide H2O2 and ammonium hydroxide NH4OH, water H2O and hydrogen peroxide H2O2. The concentrations for both of these mixtures is about 1 part HCl to about 5 parts each of H2O and H2O2.
    [0014] There has been shown and described a method for removing contaminants from a semiconductor wafer having a spin on coating of material. The particular embodiments shown and described herein are for purposes of example and should not be construed to limit the invention as set forth in the appended claims. [0014]
    权利要求:
    Claims (16)
    [1" id="US-20010009814-A1-CLM-00001] 1. A method for the manufacture of a semiconductor wafer, comprising the steps of:
    a. spinning the wafer; and
    b. applying a mixture comprising hydrochloric acid HCl and water H2O to the periphery of the spinning wafer.
    [2" id="US-20010009814-A1-CLM-00002] 2. A method for the manufacture of a semiconductor wafer, comprising the steps of:
    a. spinning the wafer;
    b. applying a mixture comprising hydrochloric acid HCl and water H2O to the periphery of the spinning wafer; and
    c. rinsing the periphery of the wafer with water.
    [3" id="US-20010009814-A1-CLM-00003] 3. A method for the manufacture of a semiconductor wafer, comprising the steps of:
    a. spinning the wafer; and
    b. applying a mixture comprising ammonium hydroxide NH4OH and water H2O to the periphery of the spinning wafer.
    [4" id="US-20010009814-A1-CLM-00004] 4. A method for the manufacture of a semiconductor wafer, comprising the steps of:
    a. spinning the wafer;
    b. applying a mixture comprising ammonium hydroxide NH4OH and water H2O to the periphery of the spinning wafer; and
    c. rinsing the periphery of the wafer with water.
    [5" id="US-20010009814-A1-CLM-00005] 5. A method for the manufacture of a semiconductor wafer, comprising the steps of:
    a. applying a coating material to a top surface of the semiconductor wafer and spinning the wafer to form a film of coating material on the top surface of the wafer;
    b. applying a solvent in which the coating material is soluble to the periphery of the spinning wafer; and then
    c. applying a cleaning solution to the periphery of the spinning wafer.
    [6" id="US-20010009814-A1-CLM-00006] 6. A method for the manufacture of a semiconductor wafer, comprising the steps of:
    a. applying a coating material to a top surface of the semiconductor wafer and spinning the wafer to form a film of coating material on the top surface of the wafer;
    b. applying a solvent in which the coating material is soluble to the periphery of the spinning wafer;
    c. applying a cleaning solution to the periphery of the spinning; and then
    d. rinsing the periphery of the wafer with water.
    [7" id="US-20010009814-A1-CLM-00007] 7. A method for the manufacture of a semiconductor wafer, comprising the steps of:
    a. applying a coating material to a top surface of the semiconductor wafer and spinning the wafer to form a film of coating material on the top surface of the wafer;
    b. applying a solvent in which the coating material is soluble to the periphery of the spinning wafer; and then
    c. applying a cleaning solution to the periphery of the spinning wafer, the cleaning solution formulated to react chemically with unwanted coating material residue to form a contaminant compound that can be ejected from the spinning wafer.
    [8" id="US-20010009814-A1-CLM-00008] 8. A method according to
    claim 7 , wherein the cleaning solution comprises hydrochloric acid HCl and water H2O.
    [9" id="US-20010009814-A1-CLM-00009] 9. A method according to
    claim 7 , wherein the cleaning solution comprises ammonium hydroxide NH4OH and water H2O.
    [10" id="US-20010009814-A1-CLM-00010] 10. A method for coating a semiconductor wafer with a metallic film, comprising the steps of:
    a. suspending a metallic material in a first solvent to form a metallic coating material suspension;
    b. applying the coating material suspension to the top surface of the semiconductor wafer and spinning the wafer to form a metallic film on the wafer.
    c. applying a second solvent in which the coating material is soluble to the periphery of the spinning wafer to remove substantially all of the film from the periphery; and
    d. applying a cleaning solution to the periphery of the spinning wafer to remove from the periphery any metallic residue remaining after the edge bead removal process of step c.
    [11" id="US-20010009814-A1-CLM-00011] 11. A method according to
    claim 10 , wherein the first and second solvents are readily miscible.
    [12" id="US-20010009814-A1-CLM-00012] 12. A method according to
    claim 10 , wherein the first and second solvents are the same.
    [13" id="US-20010009814-A1-CLM-00013] 13. A method for coating a semiconductor wafer with a metallic film, comprising the steps of:
    a. suspending a metallic material in a first solvent to form a metallic coating material suspension;
    b. applying the coating material suspension to the top surface of the semiconductor wafer and spinning the wafer to form a metallic film on the wafer;
    c. applying a second solvent in which the coating material is soluble to the periphery of the spinning wafer to remove substantially all of the film from the periphery;
    d. applying a cleaning solution to the periphery of the spinning wafer to remove from the periphery any metallic residue remaining after the edge bead removal process of step c; and then
    e. rinsing the periphery of the wafer with water.
    [14" id="US-20010009814-A1-CLM-00014] 14. A method for coating a semiconductor wafer with a metallic film, comprising the steps of:
    a. suspending a metallic material in a first solvent to form a metallic coating material suspension;
    b. applying the coating material suspension to the top surface of the semiconductor wafer and spinning the wafer to form a metallic film on the wafer;
    c. applying a second solvent in which the coating material is soluble to the periphery of the spinning wafer to remove substantially all of the film from the periphery; and
    d. applying a cleaning solution to the periphery of the spinning wafer to remove from the periphery any metallic residue remaining after the edge bead removal process of step c, the cleaning solution formulated to react chemically with unwanted metallic ions to form a compound that can be ejected from the spinning wafer.
    [15" id="US-20010009814-A1-CLM-00015] 15. A method according to
    claim 15 , wherein the cleaning solution comprises hydrochloric acid HCl and water H2O.
    [16" id="US-20010009814-A1-CLM-00016] 16. A method according to
    claim 15 , wherein the cleaning solution comprises ammonium hyrdroxide NH4OH and water H2O.
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    法律状态:
    2006-06-16| FPAY| Fee payment|Year of fee payment: 4 |
    2010-06-16| FPAY| Fee payment|Year of fee payment: 8 |
    2014-08-22| REMI| Maintenance fee reminder mailed|
    2015-01-14| LAPS| Lapse for failure to pay maintenance fees|
    2015-02-09| STCH| Information on status: patent discontinuation|Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
    2015-03-03| FP| Lapsed due to failure to pay maintenance fee|Effective date: 20150114 |
    优先权:
    申请号 | 申请日 | 专利标题
    US08/729,855|US6114254A|1996-10-15|1996-10-15|Method for removing contaminants from a semiconductor wafer|
    US09/584,240|US6255228B1|1996-10-15|2000-05-30|Method for removing contaminants from a semiconductor wafer|
    US09/804,604|US6506689B2|1996-10-15|2001-03-12|Method for removing contaminants from a semiconductor wafer|US09/804,604| US6506689B2|1996-10-15|2001-03-12|Method for removing contaminants from a semiconductor wafer|
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